Japanese page
menubdr
Home
Close-up
Corporate Data
Products
Network
Inquiry
Sitemap
blank

 

●Close-up
Our PYROPHOSPHATE compounds
For the materials of NON-CYANIDE type Copper-Tin alloy plating bath,
-Stannous Pyrophosphate-【spec】
-Copper Pyrophosphate-【spec】
-Potassium Pyrophosphate-【spec】
Our COPPER compounds
For Plating of PCB
-Cupric Oxide DCL-【spec】
For the material of SOFT-ETCHING,
-Cupric Chloride-【spec】
If you are interest, please feel free to email, sea@nihonkagakusangyo.co.jp
- NICKEL BOOMER series -
Lead Free Electroless Nickel Plating
In addition, we have the following product to reduce costs.
    - NICKEL BOOMER additive type -
  • *You need to prepare Nickel sulfate and Sodium hypophosphite.
    If you are interest, please feel free to email, sea@nihonkagakusangyo.co.jp
- ALMITE SEALER -
Sealing Agent for Anodized Aluminum Coating
We have two types, powder and liquid.
- Chromium (III) Compounds -
Raw-materials for 3-Valent Chromate
- Nickel Sulfamate -
For Nickel Plating
We recommend this product as Au, Ag, Pd undercoating and Tin-Lead plating.
We have two types, powder and liquid.
- ETCHANT FOR Cr -
Our trade name 50%CAN solution
- Sodium stannate & Potassium stannate -
Tin replenishment for Cu-Tin alloy plating
All rights reserved (c)2012 NIHON KAGAKU SANGYO CO.,LTD.